R&D Integration Channel

Advanced Hardware & Topology R&D Customization

Dedicated to OEM partners and system integrators. We offer tailored engineering services including high-voltage MCPCB creepage compliance development, 6061 aviation aluminum rotor topology stress simulation, custom cold-plate heatsink designs, and dedicated bus protocol modifications.

Step 1

Submit Requirements

Specify technical parameters & boundary constraints

Step 2

R&D Evaluation

Feasibility assessment feedback within 48h

Step 3

Sample Delivery

Custom Hardware + SDK + Technical Docs

Company / Organization Name *

Official Email *

Product Line of Interest

Key Performance Indicators & Custom Specifications

We typically respond within 1–2 business days. Priority given to B2B partners.

Customization Capabilities

· Hardware topology redesign & PCB layout optimization
· 400V / 800V creepage distance safety verification
· Custom shape liquid cooling plate design
· Customized CAN / UART / RS485 communication protocols

Direct Contact with R&D

Email: support@hifei.com
Tel: +86 (23) 68626070
Address: 3F, Building B1, Area E, Shuguang Industrial Park, Jiangbei District, Chongqing, China